Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11291124 | Method for manufacturing multilayer wiring board | Eiichi Shinada, Masahiro Kato | 2022-03-29 |
| 11240915 | Method for manufacturing multilayer wiring board | Masahiro Kato, Eiichi Shinada | 2022-02-01 |