Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11507017 | Package aspect of heat-dissipating lid and reservoir structure for liquid thermal interfacing materials | — | 2022-11-22 |
| 11373931 | Lid allowing for liquid metal thermal interfacing materials in a lidded flip chip package | — | 2022-06-28 |
| 11296010 | Heat sink aspect of heat dissipating lid and reservoir structure flip chip package for liquid thermal interfacing materials | — | 2022-04-05 |