Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11337310 | Printed circuit board with lateral metallization groove and processing method thereof | Qinghua Li, Renjun Zhang, Zhiqiang Hu, Yugui Mou | 2022-05-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11337310 | Printed circuit board with lateral metallization groove and processing method thereof | Qinghua Li, Renjun Zhang, Zhiqiang Hu, Yugui Mou | 2022-05-17 |