Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398417 | Semiconductor package having die pad with cooling fins | — | 2022-07-26 |
| 11348863 | Semiconductor package having a semiconductor die on a plated conductive layer | — | 2022-05-31 |
| 11270894 | Manufacturing method for semiconductor package with cantilever pads | Godfrey Dimayuga | 2022-03-08 |
| 11227776 | Leadframe package with pre-applied filler material | Frederick Ray Gomez | 2022-01-18 |
| 11227817 | Compact leadframe package | — | 2022-01-18 |