Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393774 | Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads | — | 2022-07-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393774 | Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads | — | 2022-07-19 |