Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476161 | Wafer processing method including applying a polyolefin sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-10-18 |
| 11393721 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-07-19 |
| 11380588 | Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-07-05 |
| 11380587 | Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-07-05 |
| 11361997 | Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-06-14 |
| 11348797 | Stacked wafer processing method | Shigenori Harada, Koji Watanabe, Jinyan Zhao | 2022-05-31 |
| 11322407 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-05-03 |
| 11322406 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-05-03 |
| 11302578 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-04-12 |
| 11289379 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-03-29 |
| 11270916 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-03-08 |
| 11251082 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Taro Arakawa, Masamitsu Agari +4 more | 2022-02-15 |
| 11222807 | Processing method and thermocompression bonding method for workpiece | Naoko Yamamoto, Atsushi Kubo | 2022-01-11 |