Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11422597 | Predetermining separate thermal control points for chips of a multi-chip module | Eric Marz, Kirk D. Peterson, Greg Abrami, Howard Victor Mahaney, Jr., Eric Jason Fluhr +1 more | 2022-08-23 |
| 11385002 | Implementing modular baffling mechanism for selectively redirecting and impeding airflow | Khaalid Persaud Juggan McMillan, Jason R. Eagle, Robert K. Mullady, Scott R. LaPree, Robert R. Genest | 2022-07-12 |
| 11326621 | Implementing electronic enclosure cooling containment for concurrent maintenance actions | Phillip V. Mann | 2022-05-10 |