Issued Patents 2022
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515334 | Stacked vertically isolated MOSFET structure and method of forming the same | Yu-Shiang Huang, Hung-Yu Yeh, Chee-Wee Liu | 2022-11-29 |
| 11515234 | Semiconductor device package including promoters and method of manufacturing the same | — | 2022-11-29 |
| 11488901 | Package structure and method for manufacturing the same | — | 2022-11-01 |
| 11430750 | Semiconductor device package having an antenna formed over a foaming agent filled cavity in a support layer | Min-Lung Huang, Yuh-Shan Su | 2022-08-30 |
| 11410944 | Stacked structure, package structure and method for manufacturing the same | — | 2022-08-09 |
| 11411082 | Nanowire stack GAA device with selectable numbers of channel strips | Ya-Jui Tsou, Zong-You Luo, Jhih-Yang Yan, Chee-Wee Liu | 2022-08-09 |
| 11398419 | Wiring structure and method for manufacturing the same | — | 2022-07-26 |
| 11393747 | Substrate structure having roughned upper surface of conductive layer | — | 2022-07-19 |
| 11355426 | Wiring structure and method for manufacturing the same | Min-Lung Huang | 2022-06-07 |
| 11329007 | Wiring structure and method for manufacturing the same | Yan Wen CHUNG, Huei-Shyong Cho | 2022-05-10 |
| 11328989 | Wiring structure and method for manufacturing the same | — | 2022-05-10 |
| 11322471 | Semiconductor package structures, semiconductor device packages and methods of manufacturing the same | — | 2022-05-03 |
| 11309295 | Semiconductor device package | Wen-Chieh Yang | 2022-04-19 |
| 11309264 | Semiconductor device package | — | 2022-04-19 |
| 11302619 | Device structure and method for manufacturing the same | — | 2022-04-12 |
| 11271783 | Decision feedback equalization embedded in a slicer | Shu-Chun Yang | 2022-03-08 |
| 11264340 | Semiconductor devices, semiconductor device packages and method for manufacturing the same | — | 2022-03-01 |