Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482513 | Heterogeneous substrate bonding for photonic integration | John Dallesasse | 2022-10-25 |
| 11307440 | On-chip high capacitance termination for transmitters | Damien Lambert, Andrew Bonthron, Guoliang Li | 2022-04-19 |
| 11249253 | Systems and methods for photonic polarization rotators | John Dallesasse | 2022-02-15 |
| 11217963 | Wafer level coatings for photonic die | Murtaza Askari | 2022-01-04 |