Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11524386 | Grinding apparatus | Tetsuo Kubo, Shinji Yamashita | 2022-12-13 |
| 11491610 | Wafer grinding method | Hiroshi Shibata, Jun Koide | 2022-11-08 |
| 11389927 | Processing apparatus | Nobuyuki Fukushi, Suzu Hoshino, Hidekazu Nakayama | 2022-07-19 |