Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538756 | Bonding structure and method for manufacturing the same | Pei-Jen Lo, Chien-Han Chiu | 2022-12-27 |
| 11393776 | Semiconductor device package and method of manufacturing the same | Pei-Jen Lo, Yan-Si Lin, Chien-Chi Kuo | 2022-07-19 |