Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11375306 | Headphones with increased back volume | Esge B. Andersen, Jared M. Kole, Daniel R. Bloom, Onur I. Ilkorur, Eugene Antony Whang +3 more | 2022-06-28 |
| 11277679 | Headphone earcup structure | Jarrett B. Lagler, Michael B. Minerbi, Lee M. Panecki, Trang Fisher, Esge B. Andersen +12 more | 2022-03-15 |
| 11259107 | Headphone earpads with textile layer having a low porosity region | Mike B. Minerbi, Edward Siahaan, Benjamin Andrew Shaffer, Eugene Antony Whang, Derek W. Wright +5 more | 2022-02-22 |