Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393788 | Integrated circuit package with glass spacer | Hyoung Il Kim, Yong She, Sireesha Gogineni | 2022-07-19 |
| 11373974 | Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size | Bilal Khalaf | 2022-06-28 |