Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11294842 | Multichip package with protocol-configurable data paths | Huy Ngo, David W. Mendel | 2022-04-05 |
| 11237998 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones | 2022-02-01 |