Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11531893 | Method and apparatus with neural network parameter quantization | Hyeongseok Yu, Hyeonuk SIM | 2022-12-20 |
| 11521949 | Wire bonding apparatus | — | 2022-12-06 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11531893 | Method and apparatus with neural network parameter quantization | Hyeongseok Yu, Hyeonuk SIM | 2022-12-20 |
| 11521949 | Wire bonding apparatus | — | 2022-12-06 |