Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11483948 | Thermal interface materials including memory foam cores | Kyle Burke Huffstutler, Eric Edward Trantina | 2022-10-25 |
| 11411263 | Thermal management and/or EMI mitigation materials including coated fillers | John Song | 2022-08-09 |