HL

Hongqi Li

Micron: 3 patents #371 of 1,508Top 25%
📍 Boise, ID: #168 of 713 inventorsTop 25%
🗺 Idaho: #223 of 1,239 inventorsTop 20%
Overall (2022): #79,562 of 548,613Top 15%
3
Patents 2022

Issued Patents 2022

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11437435 On-pitch vias for semiconductor devices and associated devices and systems James A. Cultra 2022-09-06
11367681 Slit oxide and via formation techniques Kaushik Varma Sagi, Manzar Siddik 2022-06-21
11355508 Devices including floating vias and related systems and methods James A. Cultra, Sri Sai Sivakumar Vegunta 2022-06-07