Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527547 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2022-12-13 |
| 11482532 | Joint opening structures of three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Wenguang Shi, Feng Pan, Xianjin Wan, Baoyou Chen | 2022-10-25 |
| 11437400 | Three-dimensional memory device and fabricating method thereof | Ziqi Chen | 2022-09-06 |
| 11410983 | Three-dimensional memory device and fabrication method thereof | Ziqi Chen, Chao Li | 2022-08-09 |