Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462513 | Chip bonding alignment structure, chip bonding structure and methods for fabricating the same | Chin-Chia Yang, Da-Jun Lin, Bin-Siang Tsai | 2022-10-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462513 | Chip bonding alignment structure, chip bonding structure and methods for fabricating the same | Chin-Chia Yang, Da-Jun Lin, Bin-Siang Tsai | 2022-10-04 |