Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355452 | EMI shielding for flip chip package with exposed die backside | ByeongHoon Kim, Sung-Ho Choi, Sung Jae Lim, Jong-Ho Shin, SungWon Cho +2 more | 2022-06-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355452 | EMI shielding for flip chip package with exposed die backside | ByeongHoon Kim, Sung-Ho Choi, Sung Jae Lim, Jong-Ho Shin, SungWon Cho +2 more | 2022-06-07 |