Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527511 | Electronic device comprising a support substrate and stacked electronic chips | Jean-Michel Riviere | 2022-12-13 |
| 11502029 | Thin semiconductor chip using a dummy sidewall layer | Laurent Herard, David Parker | 2022-11-15 |
| 11404355 | Package with lead frame with improved lead design for discrete electrical components and manufacturing the same | Rennier Rodriguez, Bryan Christian Bacquian, Maiden Grace Maming | 2022-08-02 |
| 11366156 | Crack detection integrity check | Pedro Jr Santos PERALTA | 2022-06-21 |
| 11270946 | Package with electrical interconnection bridge | Yong Chen | 2022-03-08 |
| 11226399 | Proximity sensor with integrated ALS | — | 2022-01-18 |