Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444058 | Package structure with separated street between chips | Teng-Jui Yu, Wei Kang Tsai | 2022-09-13 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444058 | Package structure with separated street between chips | Teng-Jui Yu, Wei Kang Tsai | 2022-09-13 |