Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11230139 | Integrated envelope sealer and flip module | Arthur H. DePoi, John R. Masotta, Daniel Wright, Anthony E. Yap | 2022-01-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11230139 | Integrated envelope sealer and flip module | Arthur H. DePoi, John R. Masotta, Daniel Wright, Anthony E. Yap | 2022-01-25 |