Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373974 | Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size | Mao Guo | 2022-06-28 |
| 11329027 | Microelectronic packages having a die stack and a device within the footprint of the die stack | — | 2022-05-10 |
| 11315843 | Embedded component and methods of making the same | Yi Xu, Dennis Sean Carr | 2022-04-26 |