Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476208 | Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods | Fernando Chen, Emmanuel de los Santos, Alex Kungo | 2022-10-18 |
| 11430718 | Lead frames for semiconductor packages with increased reliability and related semiconductor device packages and methods | — | 2022-08-30 |