Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373930 | Thermal packaging with fan out wafer level processing | Matthew J. Traverso, Sandeep Razdan, Joyce Peternel, Aparna R. PRASAD | 2022-06-28 |
| 11353668 | Packaging with substrate and printed circuit board cutouts | Vipulkumar Patel, Aparna R. PRASAD | 2022-06-07 |
| 11300728 | Solder reflow compatible connections between optical components | Matthew J. Traverso, Jock T. Bovington | 2022-04-12 |