Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488883 | Semiconductor device package having thermally conductive layers for heat dissipation | Yazhou Zhang, Jiandi Du, Hope Chiu, Cong Zhang, Fen Yu +2 more | 2022-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488883 | Semiconductor device package having thermally conductive layers for heat dissipation | Yazhou Zhang, Jiandi Du, Hope Chiu, Cong Zhang, Fen Yu +2 more | 2022-11-01 |