Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355423 | Bottom package exposed die MEMS pressure sensor integrated circuit package design | Aaron Cadag, Frederick Arellano | 2022-06-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355423 | Bottom package exposed die MEMS pressure sensor integrated circuit package design | Aaron Cadag, Frederick Arellano | 2022-06-07 |