Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11531174 | Co-packaging with silicon photonics hybrid planar lightwave circuit | Sang Yup Kim, Myung Jin Yim | 2022-12-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11531174 | Co-packaging with silicon photonics hybrid planar lightwave circuit | Sang Yup Kim, Myung Jin Yim | 2022-12-20 |