Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11232996 | Semiconductor device package comprising thermal interface layer and method of fabricating of the same | Sunyong Lee, Tae Hyeob Im | 2022-01-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11232996 | Semiconductor device package comprising thermal interface layer and method of fabricating of the same | Sunyong Lee, Tae Hyeob Im | 2022-01-25 |