Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11442876 | System, apparatus and method for synchronizing multiple virtual link states over a package interconnect | Joon Teik Hor, Ting Lok Song, Su Wei Lim | 2022-09-13 |
| 11386033 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2022-07-12 |
| 11307928 | Multichip package link error detection | Venkatraman Iyer, Robert G. Blankenship, Zuoguo Wu | 2022-04-19 |
| 11308018 | Virtualized link states of multiple protocol layer package interconnects | Joon Teik Hor, Ting Lok Song, Su Wei Lim | 2022-04-19 |
| 11245604 | Techniques to support multiple interconnect protocols for a common set of interconnect connectors | Mark S. Myers, Stephen R. Van Doren, Dimitrios Ziakas, Bassam N. Coury | 2022-02-08 |