Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239126 | Rod-based substrate with ringed interconnect layers | Florence Su Sin Phun, Wei Tan, Boon Ping Koh, Nik Mohamed Azeim Nik Zurin | 2022-02-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239126 | Rod-based substrate with ringed interconnect layers | Florence Su Sin Phun, Wei Tan, Boon Ping Koh, Nik Mohamed Azeim Nik Zurin | 2022-02-01 |