Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264329 | Semiconductor device having metal interconnects with different thicknesses | Kinyip Phoa, Nidhi Nidhi, Chia-Hong Jan | 2022-03-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264329 | Semiconductor device having metal interconnects with different thicknesses | Kinyip Phoa, Nidhi Nidhi, Chia-Hong Jan | 2022-03-01 |