Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11486942 | Processor and chipset continuity testing of package interconnect for functional safety applications | Matthew W. Lee, Benedict C. Ofuonye, Erich N. Ewy | 2022-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11486942 | Processor and chipset continuity testing of package interconnect for functional safety applications | Matthew W. Lee, Benedict C. Ofuonye, Erich N. Ewy | 2022-11-01 |