Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11336286 | Scalable micro bumps indexing and redundancy scheme for homogeneous configurable integrated circuit dies | Lai Guan Tang, Kiun Kiet Jong | 2022-05-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11336286 | Scalable micro bumps indexing and redundancy scheme for homogeneous configurable integrated circuit dies | Lai Guan Tang, Kiun Kiet Jong | 2022-05-17 |