Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430944 | Interconnect structures for logic and memory devices and methods of fabrication | Christopher J. Wiegand, Oleg Golonzka | 2022-08-30 |
| 11270943 | Copper interconnect cladding | Flavio Griggio, Philip Yashar, Anthony V. Mule, Gopinath Trichy | 2022-03-08 |