Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521940 | Stiffener for die crack prevention in semiconductor packages | Eng Kwong Lee | 2022-12-06 |
| 11495514 | Bathtub integrated heat spreader with multiple thermal-interface material for integrated-circuit packages | Chun Howe Sim | 2022-11-08 |