Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11293979 | Method of and an arrangement for analyzing manufacturing defects of multi-chip modules made without known good die | — | 2022-04-05 |
| 11256762 | System and method for efficiently determining and displaying optimal packages of data items | Xiangnong Wang, Yifei Huang, Michael Yang, Francis Chen, Andy Chen +6 more | 2022-02-22 |