Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11360338 | Electronic device with a conductive adhesive for bonding a panel and a frame | Yu-Chun Huang, I-Han Liu, Ming-Tien Wang, Yung-Yu Tsai | 2022-06-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11360338 | Electronic device with a conductive adhesive for bonding a panel and a frame | Yu-Chun Huang, I-Han Liu, Ming-Tien Wang, Yung-Yu Tsai | 2022-06-14 |