Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11453823 | Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite | Kwang-Choon Chung, Su Han Kim, Jae Rin Kim | 2022-09-27 |
| 11317514 | Method for forming circuits using seed layer and etchant composition for selective etching of seed layer | Kwang-Choon Chung, Su Han Kim, Jung Yoon Moon, Hyeon-Jun Seong, Jae Rin Kim | 2022-04-26 |