Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355838 | Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave | Ashutosh Baheti, Marwa Abdel-Aziz, Mustafa Doga Dogan, Saverio Trotta, Maciej Wojnowski | 2022-06-07 |