Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11402556 | Wafer level method for manufacturing integrated infrared (IR) emitter elements having an optical IR filter placed on the main surface region of the carrier substrate on which the IR emitter is formed | Stephan Pindl | 2022-08-02 |
| 11342298 | Die stack arrangement comprising a die-attach-film tape and method for producing same | Karolina Gierl | 2022-05-24 |