Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387081 | Wafer chuck and processing arrangement | Rudolf Kogler, Wolfgang Dastel, Harald Huetter, Markus Kahn | 2022-07-12 |
| 11387095 | Passivation structuring and plating for semiconductor devices | Ravi Keshav Joshi, Andreas Behrendt, Richard Gaisberger, Anita Satz, Johanna Schlaminger +2 more | 2022-07-12 |
| 11352253 | Semiconductor device, microphone and methods for forming a semiconductor device | Markus Kahn, Anna-Katharina Kaiser, Soenke Pirk, Julia-Magdalena Straeussnigg | 2022-06-07 |