Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11523511 | Assembling and handling edge interconnect packaging system | Tian Lu | 2022-12-06 |
| 11488660 | Adiabatic flip-flop and memory cell design | Gregory S. Snider, Rene Celis-Cordova, Alexei Orlov, Tian Lu | 2022-11-01 |
| 11398463 | Edge interconnect self-assembly substrate | Tian Lu | 2022-07-26 |
| 11224126 | Edge interconnects for use with circuit boards and integrated circuits | Tian Lu, Carlos J. Ortega, Robert Joseph Engelhardt, Jr., John P. Timler | 2022-01-11 |