Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11329018 | Forming of bump structure | Takashi Hisada, Eiji Nakamura | 2022-05-10 |
| 11298769 | Prevention of dripping of material for material injection | Eiji Nakamura, Takashi Hisada | 2022-04-12 |