Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456269 | Prevention of bridging between solder joints | Risa Miyazawa, Hiroyuki Mori, Keishi Okamoto | 2022-09-27 |
| 11264314 | Interconnection with side connection to substrate | Risa Miyazawa, Hiroyuki Mori, Keishi Okamoto | 2022-03-01 |