SE

Sebastian U. Engelmann

IBM: 1 patents #3,165 of 7,845Top 45%
Overall (2022): #268,153 of 548,613Top 50%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11270893 Layer-by-layer etching of poly-granular metal-based materials for semiconductor structures John M. Papalia, Hiroyuki Miyazoe, Nathan P. Marchack 2022-03-08