Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11436402 | Electronic design 3D mixed placement and unfolding | Liqun Deng, Guozhi Xu | 2022-09-06 |
| 11276677 | Concurrent optimization of 3D-IC with asymmetrical routing layers | Liqun Deng, Pinhong Chen, Richard Chou, Chin-Chih Chang, Yufeng Luo | 2022-03-15 |
| 11244298 | Payment device, payment system and payment method | Bin Zou, Feng Bai, Liyan Wang, Hongna Ye | 2022-02-08 |