Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488890 | Direct liquid cooling with O-ring sealing | Jorge Padilla, Connor Burgess, Padam Jain, Yuan Li, Feini Zhang | 2022-11-01 |
| 11348859 | Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages | Melanie Beauchemin, Christopher G. Malone, Gregory P. Imwalle | 2022-05-31 |
| 11249264 | Thermal optimizations for OSFP optical transceiver modules | William Frank Edwards, Melanie Beauchemin, Timothy Conrad Lee, Federico P. Centola, Michael Chi Kin Lau +2 more | 2022-02-15 |