DS

Da-Yuan Shih

TSMC: 1 patents #1,889 of 3,577Top 55%
IBM: 1 patents #3,165 of 7,845Top 45%
📍 Baoshan, NY: #1 of 5 inventorsTop 20%
Overall (2022): #165,961 of 548,613Top 35%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11270966 Combination polyimide decal with a rigid mold Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro 2022-03-08
11257767 Interconnect crack arrestor structure and methods Chen-Hua Yu 2022-02-22